European Head Office - Engis UK Ltd

sales@engis.uk.com

+44 01491 411117

Hyprez Polishing Pads


Semiconductor Surface Technology with our Hyprez Polishing Pads

The production of an exacting surface finish on silicon or other semiconductor crystals has become more demanding and it has become highly critical to meet the requirements of today's semiconductor industry.  At Hyprez® we strive to meet the ever-changing needs of the industry.  We offer various polishing pad types depending on your final polishing requirements and characteristics.  We offer surface roughness, removal rat, and edge rounding options. See our selection:

PM-700 - Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven.

PM-710 - Microcell pad made from buffed polyurethane with microscopic voids, laminated to non-woven.  

HY NAP700 - Nap/flock pad made with long viscose fibres.

HY NAP 730 - Nap/flock pad made with long viscose fibres on the woven substrate.

HY NAP 780 - Nap/flock pad made with thin, short viscose fibres on the woven substrate.

HY NAP 800 - Nap/flock pad made with short viscose fibres on the woven substrate.

HLM 4F - Woven, low cost for metal polishing.

HS-4/SU - Rigid non-woven impregnated with polyurethane.

ATP 600 - Thick non-woven made from polyester/polypropylene fibres with a buffed surface.

 

Contact Us Today