Engis Corporation is a third-generation privately-owned US-based manufacturer of high-performance superabrasive lapping, grinding, honing, and polishing products and related machinery and accessories.
The company began in 1938, with offices in the US and UK, as a trading company for precision measuring equipment and industrial machinery. The company entered the abrasives market in the 1940s with the development of its Hyprez Diamond Compounds for precise polishing of critical components for defence and aviation industries. Since that time, Engis expanded its range of superabrasive products, applications, and industries served to be recognized as World Leader in Superabrasive Finishing Systems.
The company’s 131,000 square foot headquarters and manufacturing facility in Wheeling, Illinois, is located 15 miles north of Chicago’s O’Hare International Airport. To provide sales, technical, and logistical support for multinational and foreign customers, Engis has established subsidiary companies located in Canada, the UK, Japan, Korea, Singapore, Hong Kong, and China, supplemented by a worldwide network of Agents and Distributors. The State of Illinois has recognized Engis as “Exporter of the Year.”
Engis products are developed, customized and supported by teams of experienced research scientists, design and application engineers.
Our Process Development Labs provide proven results for challenging and difficult applications in addition to providing customer training. Combined with our consumable products and machinery tailored to meet your requirements, the Engis systems approach provides assurance of cost effective and consistently repeatable performance.
We take pride in our employees in their skills and accomplishments. It is our goal to provide a safe workplace where people can have a sense of purpose and pride in what they do. We have been fortunate to attract and retain talented employees who have spent almost their entire careers at Engis. Engis is also committed to develop and train a new generation of employees.